54LS08/BCA
vs
SN74LS08J
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
MOTOROLA INC
|
| Package Description |
DIP, DIP14,.3
|
DIP, DIP14,.3
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
R-XDIP-T14
|
R-GDIP-T14
|
| JESD-609 Code |
e0
|
e0
|
| Logic IC Type |
AND GATE
|
AND GATE
|
| Max I(ol) |
0.004 A
|
0.008 A
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Package Body Material |
CERAMIC
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP14,.3
|
DIP14,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Power Supply Current-Max (ICC) |
8.8 mA
|
8.8 mA
|
| Prop. Delay@Nom-Sup |
20 ns
|
20 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Schmitt Trigger |
NO
|
NO
|
| Screening Level |
38535Q/M;38534H;883B
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
MILITARY
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
3
|
4
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
14
|
| Family |
|
LS
|
| Length |
|
19.495 mm
|
| Load Capacitance (CL) |
|
15 pF
|
| Number of Functions |
|
4
|
| Number of Inputs |
|
2
|
| Propagation Delay (tpd) |
|
20 ns
|
| Seated Height-Max |
|
5.08 mm
|
| Supply Voltage-Max (Vsup) |
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
|
4.75 V
|
| Width |
|
7.62 mm
|
|
|
|
Compare 54LS08/BCA with alternatives
Compare SN74LS08J with alternatives