54HSC74FB
vs
54HHSC74LC
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
GEC PLESSEY SEMICONDUCTORS
|
GEC PLESSEY SEMICONDUCTORS
|
| Package Description |
DFP, FL14,.3
|
,
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
RADIATION HARD CMOS/SILICON ON SAPPHIRE (SOS) TECHNOLOGY
|
RADIATION HARD CMOS/SILICON ON SAPPHIRE (SOS) TECHNOLOGY
|
| Family |
HSC
|
HSC
|
| JESD-30 Code |
R-CDFP-F14
|
S-CQCC-N20
|
| JESD-609 Code |
e0
|
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
| Max I(ol) |
0.009 A
|
|
| Number of Bits |
1
|
1
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
14
|
20
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DFP
|
|
| Package Equivalence Code |
FL14,.3
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
FLATPACK
|
CHIP CARRIER
|
| Prop. Delay@Nom-Sup |
25 ns
|
|
| Propagation Delay (tpd) |
25 ns
|
25 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
38535Q/M;38534H;883B
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
FLAT
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
QUAD
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare 54HSC74FB with alternatives
Compare 54HHSC74LC with alternatives