54HHSC157CB
vs
54HSC151LL
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
GEC PLESSEY SEMICONDUCTORS
|
GEC PLESSEY SEMICONDUCTORS
|
| Package Description |
DIP, DIP16,.3
|
,
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
HSC
|
HSC
|
| JESD-30 Code |
R-CDIP-T16
|
S-CQCC-N20
|
| JESD-609 Code |
e0
|
|
| Length |
20.58 mm
|
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Max I(ol) |
0.009 A
|
|
| Number of Functions |
4
|
1
|
| Number of Inputs |
2
|
8
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
16
|
20
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Polarity |
TRUE
|
COMPLEMENTARY
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
QCCN
|
| Package Equivalence Code |
DIP16,.3
|
LCC20,.35SQ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
CHIP CARRIER
|
| Prop. Delay@Nom-Sup |
25 ns
|
|
| Propagation Delay (tpd) |
25 ns
|
25 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
38535Q/M;38534H;883B
|
|
| Seated Height-Max |
5.6 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
QUAD
|
| Total Dose |
1M Rad(Si) V
|
|
| Width |
7.62 mm
|
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare 54HHSC157CB with alternatives
Compare 54HSC151LL with alternatives