54HHSC157CB vs 54HSC151FD feature comparison

54HHSC157CB Dynex Semiconductor

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54HSC151FD Dynex Semiconductor

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer GEC PLESSEY SEMICONDUCTORS GEC PLESSEY SEMICONDUCTORS
Package Description DIP, DIP16,.3 ,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HSC HSC
JESD-30 Code R-CDIP-T16 R-CDFP-F16
JESD-609 Code e0
Length 20.58 mm
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.009 A
Number of Functions 4 1
Number of Inputs 2 8
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Polarity TRUE COMPLEMENTARY
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DFP
Package Equivalence Code DIP16,.3 FL16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE FLATPACK
Prop. Delay@Nom-Sup 25 ns
Propagation Delay (tpd) 25 ns 25 ns
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 5.6 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE FLAT
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Total Dose 1M Rad(Si) V
Width 7.62 mm
Base Number Matches 2 1
Load Capacitance (CL) 50 pF

Compare 54HHSC157CB with alternatives

Compare 54HSC151FD with alternatives