54HHSC157CB
vs
54HSC151FD
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
GEC PLESSEY SEMICONDUCTORS
GEC PLESSEY SEMICONDUCTORS
Package Description
DIP, DIP16,.3
,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HSC
HSC
JESD-30 Code
R-CDIP-T16
R-CDFP-F16
JESD-609 Code
e0
Length
20.58 mm
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Max I(ol)
0.009 A
Number of Functions
4
1
Number of Inputs
2
8
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Polarity
TRUE
COMPLEMENTARY
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DFP
Package Equivalence Code
DIP16,.3
FL16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
FLATPACK
Prop. Delay@Nom-Sup
25 ns
Propagation Delay (tpd)
25 ns
25 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
Seated Height-Max
5.6 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
FLAT
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Total Dose
1M Rad(Si) V
Width
7.62 mm
Base Number Matches
2
1
Load Capacitance (CL)
50 pF
Compare 54HHSC157CB with alternatives
Compare 54HSC151FD with alternatives