54F827SDM vs AM29C827APCB feature comparison

54F827SDM Rochester Electronics LLC

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AM29C827APCB AMD

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC ADVANCED MICRO DEVICES INC
Package Description DIP, DIP, DIP24,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature WITH DUAL OUTPUT ENABLE WITH DUAL OUTPUT ENABLE
Family F/FAST CMOS
JESD-30 Code R-GDIP-T24 R-PDIP-T24
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 10 10
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 24 24
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 7 ns 6.5 ns
Seated Height-Max 5.715 mm 5.715 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm 7.62 mm
Base Number Matches 3 1
Pbfree Code No
Rohs Code No
Part Package Code DIP
Pin Count 24
Control Type ENABLE LOW
JESD-609 Code e0
Length 31.242 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.048 A
Package Equivalence Code DIP24,.3
Prop. Delay@Nom-Sup 7.5 ns
Qualification Status Not Qualified
Terminal Finish TIN LEAD

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