54F827SDM
vs
74F827DC
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
NATIONAL SEMICONDUCTOR CORP
|
| Package Description |
DIP,
|
DIP, DIP24,.6
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
WITH DUAL OUTPUT ENABLE
|
WITH DUAL OUTPUT ENABLE
|
| Family |
F/FAST
|
F/FAST
|
| JESD-30 Code |
R-GDIP-T24
|
R-GDIP-T24
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Number of Bits |
10
|
10
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Propagation Delay (tpd) |
7 ns
|
6 ns
|
| Seated Height-Max |
5.715 mm
|
4.572 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
MILITARY
|
COMMERCIAL
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
7.62 mm
|
15.24 mm
|
| Base Number Matches |
3
|
3
|
| Rohs Code |
|
No
|
| Control Type |
|
ENABLE LOW
|
| JESD-609 Code |
|
e0
|
| Max I(ol) |
|
0.064 A
|
| Package Equivalence Code |
|
DIP24,.6
|
| Power Supply Current-Max (ICC) |
|
90 mA
|
| Prop. Delay@Nom-Sup |
|
12 ns
|
| Qualification Status |
|
Not Qualified
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare 54F827SDM with alternatives
Compare 74F827DC with alternatives