54F779DMQB
vs
54F779/BFA
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
PHILIPS COMPONENTS
|
| Package Description |
DIP, DIP16,.3
|
,
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
TCO OUTPUT; MULTIPLEXED I/O
|
|
| Count Direction |
BIDIRECTIONAL
|
BIDIRECTIONAL
|
| Family |
F/FAST
|
F/FAST
|
| JESD-30 Code |
R-GDIP-T16
|
R-CDFP-F16
|
| JESD-609 Code |
e0
|
|
| Length |
19.43 mm
|
|
| Load/Preset Input |
YES
|
YES
|
| Logic IC Type |
BINARY COUNTER
|
BINARY COUNTER
|
| Max I(ol) |
0.024 A
|
|
| Mode of Operation |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
DFP
|
| Package Equivalence Code |
DIP16,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
FLATPACK
|
| Power Supply Current-Max (ICC) |
110 mA
|
128 mA
|
| Propagation Delay (tpd) |
11 ns
|
11.5 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
38535Q/M;38534H;883B
|
|
| Seated Height-Max |
5.08 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
FLAT
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| Width |
7.62 mm
|
|
| fmax-Min |
100 MHz
|
110 MHz
|
| Base Number Matches |
1
|
1
|
| Load Capacitance (CL) |
|
50 pF
|
|
|
|
Compare 54F779DMQB with alternatives
Compare 54F779/BFA with alternatives