54F676DMQB
vs
N74F676N
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
PHILIPS COMPONENTS
|
| Package Description |
DIP, DIP24,.6
|
,
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
HOLD MODE; CHIP SELECT DISABLES BOTH SERIAL & PARALLEL OPERATIONS
|
HOLD MODE
|
| Count Direction |
RIGHT
|
RIGHT
|
| Family |
F/FAST
|
F/FAST
|
| JESD-30 Code |
R-CDIP-T24
|
R-PDIP-T24
|
| JESD-609 Code |
e0
|
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
PARALLEL IN SERIAL OUT
|
PARALLEL IN SERIAL OUT
|
| Max Frequency@Nom-Sup |
45000000 Hz
|
|
| Number of Bits |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP24,.6
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Power Supply Current-Max (ICC) |
72 mA
|
72 mA
|
| Propagation Delay (tpd) |
17 ns
|
13.5 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-STD-883 Class B
|
|
| Seated Height-Max |
4.572 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
MILITARY
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Trigger Type |
NEGATIVE EDGE
|
NEGATIVE EDGE
|
| Width |
15.24 mm
|
|
| fmax-Min |
90 MHz
|
90 MHz
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare 54F676DMQB with alternatives
Compare N74F676N with alternatives