54F574FM
vs
54F574/BSA
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NXP SEMICONDUCTORS
|
| Package Description |
DFP, FL20,.3
|
DFP,
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
BROADSIDE VERSION OF 374
|
BROADSIDE VERSION OF 374
|
| Family |
F/FAST
|
F/FAST
|
| JESD-30 Code |
R-GDFP-F20
|
R-CDFP-F20
|
| JESD-609 Code |
e0
|
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Max Frequency@Nom-Sup |
60000000 Hz
|
|
| Max I(ol) |
0.02 A
|
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DFP
|
DFP
|
| Package Equivalence Code |
FL20,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Power Supply Current-Max (ICC) |
86 mA
|
70 mA
|
| Propagation Delay (tpd) |
9.5 ns
|
9.5 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.286 mm
|
2.54 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Trigger Type |
POSITIVE EDGE
|
|
| Width |
6.731 mm
|
6.9215 mm
|
| Base Number Matches |
2
|
1
|
| Part Package Code |
|
DFP
|
| Pin Count |
|
20
|
|
|
|
Compare 54F574FM with alternatives
Compare 54F574/BSA with alternatives