54F399/BFAJC
vs
54F399/BFA
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MOTOROLA INC
PHILIPS SEMICONDUCTORS
Part Package Code
DFP
Package Description
DFP, FL16,.3
DFP, FL16,.3
Pin Count
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
FOUR 2:1 MUX FOLLOWED BY REGISTER
Family
F/FAST
JESD-30 Code
R-GDFP-F16
R-XDFP-F16
JESD-609 Code
e0
e0
Length
9.65 mm
Load Capacitance (CL)
50 pF
Logic IC Type
D FLIP-FLOP
MULTIPLEXER
Max Frequency@Nom-Sup
100000000 Hz
Max I(ol)
0.02 A
Number of Bits
4
Number of Functions
1
4
Number of Inputs
2
2
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Polarity
TRUE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC
Package Code
DFP
DFP
Package Equivalence Code
FL16,.3
FL16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
FLATPACK
Power Supply Current-Max (ICC)
34 mA
Propagation Delay (tpd)
11.5 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
38535Q/M;38534H;883B
Seated Height-Max
2.15 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
TTL
TTL
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
FLAT
FLAT
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
Width
6.415 mm
fmax-Min
80 MHz
Base Number Matches
3
3
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