54F399/BEA vs 74F399SJ feature comparison

54F399/BEA NXP Semiconductors

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74F399SJ Rochester Electronics LLC

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS ROCHESTER ELECTRONICS LLC
Part Package Code DIP SOIC
Package Description CERAMIC, DIP-16 5.30 MM, EIAJ TYPE2, SOP-16
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature FOUR 2:1 MUX FOLLOWED BY REGISTER FOUR 2:1 MUX FOLLOWED BY REGISTER
Family F/FAST F/FAST
JESD-30 Code R-GDIP-T16 R-PDSO-G16
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 4 4
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Output Polarity TRUE COMPLEMENTARY
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 10.5 ns 10 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 2.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology TTL TTL
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 7.62 mm 5.3 mm
fmax-Min 120 MHz 100 MHz
Base Number Matches 1 2
Pbfree Code Yes
Rohs Code Yes
JESD-609 Code e3
Length 10.2 mm
Moisture Sensitivity Level 1
Terminal Finish MATTE TIN

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