54F37/BDA
vs
N54F37/BDA
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
PHILIPS COMPONENTS
|
NXP SEMICONDUCTORS
|
| Package Description |
,
|
DFP,
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
F/FAST
|
F/FAST
|
| JESD-30 Code |
R-CDFP-F14
|
R-CDFP-F14
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
NAND GATE
|
NAND GATE
|
| Number of Functions |
4
|
4
|
| Number of Inputs |
2
|
2
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DFP
|
DFP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Power Supply Current-Max (ICC) |
33 mA
|
33 mA
|
| Propagation Delay (tpd) |
5.5 ns
|
5.5 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
DFP
|
| Pin Count |
|
14
|
| Length |
|
9.906 mm
|
| Seated Height-Max |
|
2.159 mm
|
| Terminal Pitch |
|
1.27 mm
|
| Width |
|
6.2865 mm
|
|
|
|
Compare 54F37/BDA with alternatives
Compare N54F37/BDA with alternatives