54F257A/BFAJC
vs
54F257A/BFA
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
NXP SEMICONDUCTORS
|
| Package Description |
DFP, FL16,.3
|
DFP, FL16,.3
|
| Reach Compliance Code |
unknown
|
unknown
|
| Family |
F/FAST
|
|
| JESD-30 Code |
R-XDFP-F16
|
R-XDFP-F16
|
| JESD-609 Code |
e0
|
e0
|
| Length |
9.65 mm
|
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Max I(ol) |
0.02 A
|
0.02 A
|
| Number of Functions |
4
|
4
|
| Number of Inputs |
2
|
2
|
| Number of Outputs |
1
|
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
|
| Package Body Material |
CERAMIC
|
CERAMIC
|
| Package Code |
DFP
|
DFP
|
| Package Equivalence Code |
FL16,.3
|
FL16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Power Supplies |
5 V
|
|
| Power Supply Current-Max (ICC) |
23 mA
|
23 mA
|
| Prop. Delay@Nom-Sup |
11.5 ns
|
11.5 ns
|
| Propagation Delay (tpd) |
9 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
38535Q/M;38534H;883B
|
38535Q/M;38534H;883B
|
| Seated Height-Max |
2.15 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
6.415 mm
|
|
| Base Number Matches |
3
|
4
|
| HTS Code |
|
8542.39.00.01
|
|
|
|
Compare 54F257A/BFAJC with alternatives
Compare 54F257A/BFA with alternatives