54F181FM-MLS
vs
MC10H304FN
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
MOTOROLA INC
Part Package Code
DFP
Package Description
DFP, FL24,.4
QCCJ, LDCC20,.4SQ
Pin Count
24
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
F/FAST
10H
JESD-30 Code
R-GDFP-F24
S-PQCC-J20
JESD-609 Code
e0
e0
Length
15.113 mm
8.9662 mm
Logic IC Type
ARITHMETIC LOGIC UNIT
PARITY GENERATOR/CHECKER
Moisture Sensitivity Level
1
Number of Bits
4
8
Number of Functions
1
2
Number of Terminals
24
20
Operating Temperature-Max
125 °C
75 °C
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DFP
QCCJ
Package Equivalence Code
FL24,.4
LDCC20,.4SQ
Package Shape
RECTANGULAR
SQUARE
Package Style
FLATPACK
CHIP CARRIER
Peak Reflow Temperature (Cel)
260
Propagation Delay (tpd)
17 ns
2.5 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
Seated Height-Max
2.54 mm
4.57 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
YES
YES
Technology
TTL
ECL
Temperature Grade
MILITARY
COMMERCIAL EXTENDED
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
FLAT
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
QUAD
Time@Peak Reflow Temperature-Max (s)
40
Base Number Matches
1
3
Output Characteristics
OPEN-EMITTER
Width
8.9662 mm
Compare 54F181FM-MLS with alternatives
Compare MC10H304FN with alternatives