54F181FM-MLS
vs
MC10H302P
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
MOTOROLA INC
Part Package Code
DFP
Package Description
DFP, FL24,.4
DIP, DIP16,.3
Pin Count
24
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
F/FAST
10H
JESD-30 Code
R-GDFP-F24
R-PDIP-T16
JESD-609 Code
e0
Length
15.113 mm
19.175 mm
Logic IC Type
ARITHMETIC LOGIC UNIT
PARITY GENERATOR/CHECKER
Moisture Sensitivity Level
1
Number of Bits
4
6
Number of Functions
1
2
Number of Terminals
24
16
Operating Temperature-Max
125 °C
75 °C
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DFP
DIP
Package Equivalence Code
FL24,.4
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
IN-LINE
Peak Reflow Temperature (Cel)
260
Propagation Delay (tpd)
17 ns
2.5 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
Seated Height-Max
2.54 mm
4.44 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
YES
NO
Technology
TTL
ECL
Temperature Grade
MILITARY
COMMERCIAL EXTENDED
Terminal Finish
TIN LEAD
Terminal Form
FLAT
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
Base Number Matches
1
3
Output Characteristics
OPEN-EMITTER
Width
7.62 mm
Compare 54F181FM-MLS with alternatives
Compare MC10H302P with alternatives