54F174/B2A
vs
54F174/BEAJC
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MOTOROLA INC
|
| Part Package Code |
QLCC
|
|
| Package Description |
CERAMIC, LLCC-20
|
DIP, DIP16,.3
|
| Pin Count |
20
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
F/FAST
|
F/FAST
|
| JESD-30 Code |
S-CQCC-N20
|
R-GDIP-T16
|
| Length |
8.89 mm
|
19.3 mm
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
| Number of Bits |
6
|
6
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
16
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
QCCN
|
DIP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
IN-LINE
|
| Power Supply Current-Max (ICC) |
45 mA
|
45 mA
|
| Propagation Delay (tpd) |
11.5 ns
|
13 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.905 mm
|
4.19 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| Width |
8.89 mm
|
7.62 mm
|
| fmax-Min |
80 MHz
|
70 MHz
|
| Base Number Matches |
2
|
1
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Max Frequency@Nom-Sup |
|
90000000 Hz
|
| Max I(ol) |
|
0.02 A
|
| Package Equivalence Code |
|
DIP16,.3
|
| Screening Level |
|
38535Q/M;38534H;883B
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare 54F174/B2A with alternatives
Compare 54F174/BEAJC with alternatives