54F112/BFA
vs
54F112L1M
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
FAIRCHILD SEMICONDUCTOR CORP
|
| Package Description |
DFP, FL16,.3
|
QCCN,
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
R-XDFP-F16
|
S-CQCC-N20
|
| JESD-609 Code |
e0
|
|
| Logic IC Type |
J-K FLIP-FLOP
|
J-K FLIP-FLOP
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
16
|
20
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
CERAMIC
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DFP
|
QCCN
|
| Package Equivalence Code |
FL16,.3
|
LCC20,.35SQ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
FLATPACK
|
CHIP CARRIER
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
38535Q/M;38534H;883B
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
FLAT
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Trigger Type |
NEGATIVE EDGE
|
NEGATIVE EDGE
|
| Base Number Matches |
3
|
1
|
| Part Package Code |
|
QLCC
|
| Pin Count |
|
20
|
| Family |
|
F/FAST
|
| Length |
|
8.89 mm
|
| Number of Bits |
|
2
|
| Output Polarity |
|
COMPLEMENTARY
|
| Propagation Delay (tpd) |
|
6.5 ns
|
| Seated Height-Max |
|
2.54 mm
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
4.5 V
|
| Width |
|
8.89 mm
|
| fmax-Min |
|
130 MHz
|
|
|
|
Compare 54F112L1M with alternatives