54F10/BCA
vs
MC74F10N
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
PHILIPS SEMICONDUCTORS
MOTOROLA INC
Package Description
DIP-14
DIP,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-XDIP-T14
R-PDIP-T14
JESD-609 Code
e0
e0
Logic IC Type
NAND GATE
NAND GATE
Number of Terminals
14
14
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
Screening Level
38535Q/M;38534H;883B
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
3
3
Pbfree Code
Part Package Code
DIP
Pin Count
14
Family
F/FAST
Length
18.86 mm
Load Capacitance (CL)
50 pF
Number of Functions
3
Number of Inputs
3
Power Supply Current-Max (ICC)
7.7 mA
Propagation Delay (tpd)
5.3 ns
Seated Height-Max
4.69 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Width
7.62 mm
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