54F00MD8
vs
74HCT00BQ
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
PHILIPS SEMICONDUCTORS
|
| Package Description |
DIE,
|
QCCN, LCC14,.1X.12,20
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
F/FAST
|
|
| JESD-30 Code |
R-XUUC-N14
|
R-PQCC-N14
|
| Logic IC Type |
NAND GATE
|
NAND GATE
|
| Number of Functions |
4
|
|
| Number of Inputs |
2
|
|
| Number of Terminals |
14
|
14
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
DIE
|
QCCN
|
| Package Equivalence Code |
DIE OR CHIP
|
LCC14,.1X.12,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
UNCASED CHIP
|
CHIP CARRIER
|
| Propagation Delay (tpd) |
4.3 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Technology |
TTL
|
CMOS
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Position |
UPPER
|
QUAD
|
| Base Number Matches |
3
|
3
|
| Rohs Code |
|
Yes
|
| JESD-609 Code |
|
e4
|
| Load Capacitance (CL) |
|
50 pF
|
| Max I(ol) |
|
0.004 A
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Packing Method |
|
TR
|
| Prop. Delay@Nom-Sup |
|
29 ns
|
| Schmitt Trigger |
|
NO
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Temperature Grade |
|
AUTOMOTIVE
|
| Terminal Finish |
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Pitch |
|
0.5 mm
|
|
|
|
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