54ALS30AJ/883
vs
DM54ALS30J/883
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
Package Description |
DIP-14
|
DIP, DIP14,.3
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
R-XDIP-T14
|
R-XDIP-T14
|
Logic IC Type |
NAND GATE
|
NAND GATE
|
Max I(ol) |
0.004 A
|
|
Number of Terminals |
14
|
14
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Package Body Material |
CERAMIC
|
CERAMIC
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP14,.3
|
DIP14,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Power Supply Current-Max (ICC) |
0.9 mA
|
|
Prop. Delay@Nom-Sup |
15 ns
|
17 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Schmitt Trigger |
NO
|
NO
|
Screening Level |
38535Q/M;38534H;883B
|
38535Q/M;38534H;883B
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
TTL
|
TTL
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
4
|
3
|
Rohs Code |
|
No
|
JESD-609 Code |
|
e0
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
Compare 54ALS30AJ/883 with alternatives
Compare DM54ALS30J/883 with alternatives