54ACT157DMQB vs MC74ACT157N feature comparison

54ACT157DMQB National Semiconductor Corporation

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MC74ACT157N onsemi

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP ON SEMICONDUCTOR
Package Description DIP, DIP16,.3 DIP, DIP16,.3
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family ACT ACT
JESD-30 Code R-GDIP-T16 R-PDIP-T16
JESD-609 Code e0 e0
Length 19.43 mm 19.175 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.024 A 0.024 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Prop. Delay@Nom-Sup 9 ns 10.5 ns
Propagation Delay (tpd) 11.5 ns 8.5 ns
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 5.08 mm 4.44 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 2 2
Pbfree Code No
Part Package Code DIP
Pin Count 16
Factory Lead Time 4 Weeks
Additional Feature TTL COMPATIBLE INPUTS
Packing Method RAIL
Peak Reflow Temperature (Cel) 235
Time@Peak Reflow Temperature-Max (s) 30

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