54AC175JRQMLV
vs
M38510/31603BFA
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
TELEDYNE E2V (UK) LTD
|
Package Description |
DIP-16
|
DFP, FL16,.3
|
Reach Compliance Code |
not_compliant
|
compliant
|
Family |
AC
|
LS
|
JESD-30 Code |
R-GDIP-T16
|
R-GDFP-F16
|
JESD-609 Code |
e0
|
e0
|
Length |
19.43 mm
|
|
Load Capacitance (CL) |
50 pF
|
|
Logic IC Type |
D FLIP-FLOP
|
D LATCH
|
Max I(ol) |
0.012 A
|
0.004 A
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Output Polarity |
COMPLEMENTARY
|
TRUE
|
Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
Package Code |
DIP
|
DFP
|
Package Equivalence Code |
DIP16,.3
|
FL16,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
FLATPACK
|
Peak Reflow Temperature (Cel) |
260
|
|
Propagation Delay (tpd) |
15 ns
|
56 ns
|
Qualification Status |
Not Qualified
|
Qualified
|
Screening Level |
MIL-PRF-38535 Class V
|
38535Q/M;38534H;883B
|
Seated Height-Max |
5.08 mm
|
|
Supply Voltage-Max (Vsup) |
6 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
TTL
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
THROUGH-HOLE
|
FLAT
|
Terminal Pitch |
2.54 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Trigger Type |
POSITIVE EDGE
|
NEGATIVE EDGE
|
Width |
7.62 mm
|
|
fmax-Min |
95 MHz
|
|
Base Number Matches |
1
|
1
|
Part Package Code |
|
DFP
|
Pin Count |
|
16
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.39.00.01
|
Number of Bits |
|
8
|
Power Supply Current-Max (ICC) |
|
36 mA
|
Prop. Delay@Nom-Sup |
|
56 ns
|
|
|
|
Compare 54AC175JRQMLV with alternatives
Compare M38510/31603BFA with alternatives