54AC174MW8
vs
54AC174FMQB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
NATIONAL SEMICONDUCTOR CORP
Package Description
DIE,
DFP, FL16,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
AC
AC
JESD-30 Code
X-XUUC-N16
R-GDFP-F16
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Max I(ol)
0.024 A
0.024 A
Number of Bits
1
6
Number of Functions
6
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Polarity
TRUE
TRUE
Package Body Material
UNSPECIFIED
CERAMIC, GLASS-SEALED
Package Code
DIE
DFP
Package Equivalence Code
DIE OR CHIP
FL16,.3
Package Shape
UNSPECIFIED
RECTANGULAR
Package Style
UNCASED CHIP
FLATPACK
Propagation Delay (tpd)
13 ns
14 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
NO LEAD
FLAT
Terminal Position
UPPER
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
fmax-Min
90 MHz
90 MHz
Base Number Matches
2
4
Rohs Code
JESD-609 Code
e0
Length
9.6645 mm
Load Capacitance (CL)
50 pF
Packing Method
TUBE
Screening Level
38535Q/M;38534H;883B
Seated Height-Max
2.032 mm
Terminal Finish
TIN LEAD
Terminal Pitch
1.27 mm
Width
6.604 mm
Compare 54AC174MW8 with alternatives
Compare 54AC174FMQB with alternatives