54AC174DMQB
vs
TC74AC174P
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
TOSHIBA CORP
Package Description
DIP, DIP16,.3
DIP, DIP16,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
AC
AC
JESD-30 Code
R-GDIP-T16
R-PDIP-T16
JESD-609 Code
e0
Length
19.43 mm
19.25 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Max I(ol)
0.024 A
0.024 A
Number of Bits
6
6
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Polarity
TRUE
TRUE
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Packing Method
TUBE
Propagation Delay (tpd)
14 ns
16.6 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
Seated Height-Max
5.08 mm
4.45 mm
Supply Voltage-Max (Vsup)
6 V
5.5 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
7.62 mm
7.62 mm
fmax-Min
90 MHz
90 MHz
Base Number Matches
4
1
Part Package Code
DIP
Pin Count
16
Max Frequency@Nom-Sup
60000000 Hz
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Power Supply Current-Max (ICC)
0.08 mA
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
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Compare TC74AC174P with alternatives