54AC139FM
vs
54AC139MDS
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Package Description |
DFP, FL16,.3
|
DIE,
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
AC
|
AC
|
| Input Conditioning |
STANDARD
|
STANDARD
|
| JESD-30 Code |
R-GDFP-F16
|
X-XUUC-N16
|
| Length |
9.6645 mm
|
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
2-LINE TO 4-LINE DECODER
|
2-LINE TO 4-LINE DECODER
|
| Max I(ol) |
0.024 A
|
0.024 A
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-55 °C
|
|
| Output Polarity |
INVERTED
|
INVERTED
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
UNSPECIFIED
|
| Package Code |
DFP
|
DIE
|
| Package Equivalence Code |
FL16,.3
|
DIE OR CHIP
|
| Package Shape |
RECTANGULAR
|
UNSPECIFIED
|
| Package Style |
FLATPACK
|
UNCASED CHIP
|
| Power Supply Current-Max (ICC) |
0.08 mA
|
0.08 mA
|
| Prop. Delay@Nom-Sup |
11.5 ns
|
11.5 ns
|
| Propagation Delay (tpd) |
14.5 ns
|
14.5 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.032 mm
|
|
| Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
|
| Terminal Form |
FLAT
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
UPPER
|
| Width |
6.604 mm
|
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare 54AC139FM with alternatives
Compare 54AC139MDS with alternatives