54ABT573/BRA vs SN74ABT573ANE4 feature comparison

54ABT573/BRA NXP Semiconductors

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SN74ABT573ANE4 Texas Instruments

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS TEXAS INSTRUMENTS INC
Part Package Code DIP DIP
Package Description DIP, DIP, DIP20,.3
Pin Count 20 20
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature BROADSIDE VERSION OF 373 BROADSIDE VERSION OF 373
Family ABT ABT
JESD-30 Code R-GDIP-T20 R-PDIP-T20
Load Capacitance (CL) 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 8 8
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supply Current-Max (ICC) 30 mA
Propagation Delay (tpd) 7.5 ns 7.2 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BICMOS BICMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 2 1
Pbfree Code Yes
Rohs Code Yes
JESD-609 Code e4
Length 25.4 mm
Max I(ol) 0.064 A
Package Equivalence Code DIP20,.3
Packing Method TUBE
Prop. Delay@Nom-Sup 6.2 ns
Terminal Finish NICKEL PALLADIUM GOLD

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Compare SN74ABT573ANE4 with alternatives