53S281AJ
vs
CBP28LA22MJ
feature comparison
| Rohs Code |
|
No
|
| Part Life Cycle Code |
|
Obsolete
|
| Ihs Manufacturer |
|
TEXAS INSTRUMENTS INC
|
| Package Description |
|
DIP, DIP20,.3
|
| Reach Compliance Code |
|
not_compliant
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.32.00.71
|
| Access Time-Max |
|
140 ns
|
| JESD-30 Code |
|
R-XDIP-T20
|
| Memory Density |
|
16384 bit
|
| Memory IC Type |
|
OTP ROM
|
| Memory Width |
|
8
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
20
|
| Number of Words |
|
256 words
|
| Number of Words Code |
|
2000
|
| Operating Mode |
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Organization |
|
2KX8
|
| Package Body Material |
|
CERAMIC
|
| Package Code |
|
DIP
|
| Package Equivalence Code |
|
DIP20,.3
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
IN-LINE
|
| Parallel/Serial |
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Qualification Status |
|
Not Qualified
|
| Screening Level |
|
MIL-STD-883 Class B (Modified)
|
| Supply Current-Max |
|
0.046 mA
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Surface Mount |
|
NO
|
| Technology |
|
TTL
|
| Temperature Grade |
|
MILITARY
|
| Terminal Form |
|
THROUGH-HOLE
|
| Terminal Pitch |
|
2.54 mm
|
| Terminal Position |
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Base Number Matches |
|
2
|
|
|
|
Compare CBP28LA22MJ with alternatives