529/BCA vs LM361MX feature comparison

529/BCA NXP Semiconductors

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LM361MX Texas Instruments

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS TEXAS INSTRUMENTS INC
Part Package Code DIP SOIC
Package Description DIP, SOP, SOP14,.25
Pin Count 14 14
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Amplifier Type COMPARATOR COMPARATOR
Average Bias Current-Max (IIB) 36 µA 0.00003 µA
Input Offset Voltage-Max 6000 µV 5000 µV
JESD-30 Code R-GDIP-T14 R-PDSO-G14
Length 19.43 mm 8.6235 mm
Neg Supply Voltage Limit-Max -15 V -16 V
Neg Supply Voltage-Nom (Vsup) -10 V -10 V
Number of Functions 1 1
Number of Terminals 14 14
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Output Type TOTEM POLE TOTEM POLE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Response Time-Nom 2 ns 14 ns
Seated Height-Max 5.08 mm 1.753 mm
Supply Current-Max 10 mA
Supply Voltage Limit-Max 15 V 16 V
Supply Voltage-Nom (Vsup) 10 V 10 V
Surface Mount NO YES
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 3.9 mm
Base Number Matches 1 2
Pbfree Code No
Rohs Code No
Bias Current-Max (IIB) @25C 0.00003 µA
JESD-609 Code e0
Moisture Sensitivity Level 1
Package Equivalence Code SOP14,.25
Peak Reflow Temperature (Cel) 235
Terminal Finish TIN LEAD
Time@Peak Reflow Temperature-Max (s) 20

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