Findchips: Compare 529/BCA vs 529/BCA

529/BCA vs 529/BCA feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	NXP SEMICONDUCTORS	PHILIPS COMPONENTS
Part Package Code	DIP
Package Description	DIP,	,
Pin Count	14
Reach Compliance Code	unknown	unknown
ECCN Code	EAR99	EAR99
HTS Code	8542.39.00.01	8542.39.00.01
Amplifier Type	COMPARATOR	COMPARATOR
Average Bias Current-Max (IIB)	36 µA	36 µA
Input Offset Voltage-Max	6000 µV	6000 µV
JESD-30 Code	R-GDIP-T14	R-CDIP-T14
Length	19.43 mm
Neg Supply Voltage Limit-Max	-15 V	-15 V
Neg Supply Voltage-Nom (Vsup)	-10 V	-10 V
Number of Functions	1	1
Number of Terminals	14	14
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-55 °C	-55 °C
Output Type	TOTEM POLE	TOTEM POLE
Package Body Material	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED
Package Code	DIP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	IN-LINE	IN-LINE
Qualification Status	Not Qualified	Not Qualified
Response Time-Nom	2 ns	12 ns
Seated Height-Max	5.08 mm
Supply Current-Max	10 mA
Supply Voltage Limit-Max	15 V	15 V
Supply Voltage-Nom (Vsup)	10 V	10 V
Surface Mount	NO	NO
Technology	BIPOLAR	BIPOLAR
Temperature Grade	MILITARY	MILITARY
Terminal Form	THROUGH-HOLE	THROUGH-HOLE
Terminal Pitch	2.54 mm
Terminal Position	DUAL	DUAL
Width	7.62 mm
Base Number Matches	1	1
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