5018/BWA
vs
SE5018N
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
PHILIPS SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
DIP, DIP22,.4
0.400 INCH, PLASTIC, DIP-22
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Converter Type
D/A CONVERTER
D/A CONVERTER
Input Bit Code
BINARY, OFFSET BINARY
BINARY
JESD-30 Code
R-XDIP-T22
R-PDIP-T22
JESD-609 Code
e0
Linearity Error-Max (EL)
0.19%
0.19%
Negative Supply Voltage-Nom
-15 V
-15 V
Number of Bits
8
8
Number of Functions
1
1
Number of Terminals
22
22
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP22,.4
DIP22,.4
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
Supply Current-Max
15 mA
15 mA
Supply Voltage-Nom
15 V
15 V
Surface Mount
NO
NO
Technology
BIPOLAR
BIPOLAR
Temperature Grade
MILITARY
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
3
2
Part Package Code
DIP
Pin Count
22
ECCN Code
3A001.A.2.C
Analog Output Voltage-Max
5.25 V
Analog Output Voltage-Min
-5.25 V
Input Format
PARALLEL, 8 BITS
Length
28 mm
Seated Height-Max
4.83 mm
Settling Time-Nom (tstl)
2.3 µs
Width
10.16 mm
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