4N55
vs
4N55/883B#200
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROPAC INDUSTRIES INC
|
AGILENT TECHNOLOGIES INC
|
| Package Description |
DIP-16
|
HERMETIC SEALED, DIP-16
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
| HTS Code |
8541.40.80.00
|
8541.40.80.00
|
| Current Transfer Ratio-Min |
9%
|
21%
|
| Forward Current-Max |
0.02 A
|
0.02 A
|
| Forward Voltage-Max |
1.8 V
|
1.8 V
|
| Isolation Voltage-Max |
1500 V
|
1500 V
|
| JESD-609 Code |
e0
|
e0
|
| Mounting Feature |
THROUGH HOLE MOUNT
|
THROUGH HOLE MOUNT
|
| Number of Elements |
2
|
2
|
| On-State Current-Max |
0.008 A
|
0.008 A
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Power Dissipation-Max |
0.05 W
|
0.036 W
|
| Response Time-Max |
0.000006 s
|
|
| Surface Mount |
NO
|
NO
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Base Number Matches |
9
|
4
|
| Additional Feature |
|
HIGH RELIABILITY
|
| Configuration |
|
COMPLEX
|
| Data Rate-Nom |
|
0.4 MBps
|
| Hysteresis Ratio-Nom |
|
0.0125
|
| Number of Functions |
|
2
|
| Optoelectronic Device Type |
|
LOGIC IC OUTPUT OPTOCOUPLER
|
| Supply Voltage-Min |
|
2 V
|
|
|
|
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