48074-9001
vs
RJSBE-5387-C1M
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MOLEX LLC
|
AMPHENOL CORP
|
| Reach Compliance Code |
compliant
|
unknown
|
| Factory Lead Time |
12 Weeks
|
|
| Samacsys Manufacturer |
Molex
|
|
| Board Mounting Option |
PEG
|
|
| Body Breadth |
0.53 inch
|
0.5 inch
|
| Body Depth |
0.807 inch
|
0.695 inch
|
| Body Length |
0.638 inch
|
0.774 inch
|
| Body/Shell Style |
JACK
|
JACK
|
| Connector Type |
TELECOM AND DATACOM CONNECTOR
|
TELECOM AND DATACOM CONNECTOR
|
| Contact Finish Mating |
NOT SPECIFIED
|
GOLD (50) OVER NICKEL (50)
|
| Contact Gender |
MALE
|
MALE
|
| Contact Material |
NOT SPECIFIED
|
PHOSPHOR BRONZE
|
| Contact Style |
TELCOM, MODULAR
|
TELCOM, MODULAR
|
| Dielectric Withstanding Voltage |
2100VAC V
|
|
| Durability |
750 Cycles
|
|
| Insulation Resistance |
500000000 Ω
|
|
| Insulator Color |
BLACK
|
BLACK
|
| Insulator Material |
POLYETHYLENE
|
POLYETHYLENE
|
| Mounting Option 1 |
LOCKING
|
LOCKING
|
| Mounting Option 2 |
MOUNTING FLANGE
|
|
| Mounting Style |
RIGHT ANGLE
|
RIGHT ANGLE
|
| Mounting Type |
BOARD
|
BOARD
|
| Number of Ports |
1
|
1
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| PCB Contact Pattern |
RECTANGULAR
|
STAGGERED
|
| Plating Thickness |
30u inch
|
50u inch
|
| Rated Current (Signal) |
1.5 A
|
|
| Reference Standard |
UL
|
UL
|
| Shell Finish |
TIN
|
NICKEL
|
| Shell Material |
BRASS
|
COPPER ALLOY
|
| Terminal Pitch |
1.016 mm
|
2.54 mm
|
| Termination Type |
SURFACE MOUNT
|
SOLDER
|
| Total Number of Contacts |
8
|
8
|
| Base Number Matches |
1
|
1
|
| Contact Finish Termination |
|
MATTE TIN (100) OVER NICKEL (50)/GOLD FLASH OVER NICKEL (50)
|
| JESD-609 Code |
|
e3/e4
|
| Terminal Length |
|
0.125 inch
|
|
|
|
Compare 48074-9001 with alternatives
Compare RJSBE-5387-C1M with alternatives