3D7503G-20
vs
AM7992BDCB
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
DATA DELAY DEVICES INC
|
ADVANCED MICRO DEVICES INC
|
| Part Package Code |
SOIC
|
DIP
|
| Package Description |
SOP,
|
DIP,
|
| Pin Count |
14
|
24
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
R-PDSO-G14
|
R-CDIP-T24
|
| Length |
19.305 mm
|
31.9405 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
14
|
24
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
SOP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.57 mm
|
5.08 mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
|
| Telecom IC Type |
MANCHESTER ENCODER/DECODER
|
MANCHESTER ENCODER/DECODER
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
6.35 mm
|
7.62 mm
|
| Base Number Matches |
1
|
2
|
| JESD-609 Code |
|
e0
|
| Supply Current-Max |
|
180 mA
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare 3D7503G-20 with alternatives
Compare AM7992BDCB with alternatives