37LV36T/L vs 37LV36-I/L feature comparison

37LV36T/L Microchip Technology Inc

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37LV36-I/L Microchip Technology Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Part Package Code QLCC QLCC
Package Description PLASTIC, LCC-20 PLASTIC, LCC-20
Pin Count 20 20
Reach Compliance Code unknown unknown
Clock Frequency-Max (fCLK) 10 MHz 2.5 MHz
I/O Type COMMON COMMON
JESD-30 Code S-PQCC-J20 S-PQCC-J20
JESD-609 Code e0 e0
Memory Density 36288 bit 36288 bit
Memory IC Type OTP ROM OTP ROM
Number of Functions 1 1
Number of Terminals 20 20
Number of Words 1134 words 1134 words
Number of Words Code 1134 1134
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 1134X32 1134X32
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC20,.4SQ LDCC20,.4SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Power Supplies 3.3/5 V 3.3/5 V
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.00005 A 0.00005 A
Supply Current-Max 0.01 mA 0.01 mA
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.6 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Base Number Matches 3 3
Additional Feature DATA RETENTION >200 YEARS
Length 8.966 mm
Seated Height-Max 4.572 mm
Width 8.966 mm

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Compare 37LV36-I/L with alternatives