37LV128-TI/L
vs
37LV128-L
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
QLCC
|
QLCC
|
| Package Description |
QCCJ,
|
QCCJ,
|
| Pin Count |
20
|
20
|
| Reach Compliance Code |
unknown
|
unknown
|
| Additional Feature |
DATA RETENTION >200 YEARS
|
|
| Clock Frequency-Max (fCLK) |
2.5 MHz
|
10 MHz
|
| JESD-30 Code |
S-PQCC-J20
|
S-PQCC-J20
|
| Length |
8.966 mm
|
8.966 mm
|
| Memory Density |
131072 bit
|
131072 bit
|
| Memory IC Type |
OTP ROM
|
OTP ROM
|
| Memory Width |
32
|
32
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
20
|
| Number of Words |
4096 words
|
4096 words
|
| Number of Words Code |
4000
|
4000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
4KX32
|
4KX32
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QCCJ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.572 mm
|
4.572 mm
|
| Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
3.6 V
|
3.6 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
8.966 mm
|
8.966 mm
|
| Base Number Matches |
3
|
2
|
| Rohs Code |
|
Yes
|
| JESD-609 Code |
|
e3
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Terminal Finish |
|
MATTE TIN
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare 37LV128-TI/L with alternatives
Compare 37LV128-L with alternatives