37LV128-IL vs 37LV128-I/L feature comparison

37LV128-IL Microchip Technology Inc

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37LV128-I/L Microchip Technology Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Part Package Code QLCC QLCC
Package Description PLASTIC, LCC-20 PLASTIC, LCC-20
Pin Count 20 20
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 65 ns
Clock Frequency-Max (fCLK) 10 MHz 2.5 MHz
I/O Type COMMON COMMON
JESD-30 Code S-PQCC-J20 S-PQCC-J20
JESD-609 Code e0 e0
Length 8.966 mm 8.966 mm
Memory Density 16384 bit 131072 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 4
Number of Functions 1 1
Number of Terminals 20 20
Number of Words 4096 words 4096 words
Number of Words Code 4000 4000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 4KX4 4KX32
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC20,.4SQ LDCC20,.4SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial SERIAL SERIAL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.572 mm 4.572 mm
Standby Current-Max 0.00005 A 0.00005 A
Supply Current-Max 0.17 mA 0.01 mA
Supply Voltage-Nom (Vsup) 5 V 3.6 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Width 8.966 mm 8.966 mm
Base Number Matches 3 3
Additional Feature DATA RETENTION >200 YEARS
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supplies 3.3/5 V
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 3 V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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