358RPFB
vs
MPC508AU/1KG4
feature comparison
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
DATA DEVICE CORP
|
TEXAS INSTRUMENTS INC
|
Package Description |
DFP,
|
SOP, SOP16,.4
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog IC - Other Type |
SINGLE-ENDED MULTIPLEXER
|
SINGLE-ENDED MULTIPLEXER
|
JESD-30 Code |
R-XDFP-F16
|
R-PDSO-G16
|
Length |
10.541 mm
|
10.3 mm
|
Neg Supply Voltage-Max (Vsup) |
-18 V
|
|
Neg Supply Voltage-Min (Vsup) |
-4.5 V
|
|
Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
Number of Channels |
8
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
16
|
Off-state Isolation-Nom |
68 dB
|
68 dB
|
On-state Resistance-Max (Ron) |
1500 Ω
|
1500 Ω
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
DFP
|
SOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLATPACK
|
SMALL OUTLINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.6322 mm
|
2.65 mm
|
Supply Voltage-Max (Vsup) |
18 V
|
15 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
|
Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
Surface Mount |
YES
|
YES
|
Switch-off Time-Max |
500 ns
|
500 ns
|
Switch-on Time-Max |
500 ns
|
500 ns
|
Temperature Grade |
MILITARY
|
INDUSTRIAL
|
Terminal Form |
FLAT
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
7.112 mm
|
7.5 mm
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Part Package Code |
|
SOIC
|
Pin Count |
|
16
|
ECCN Code |
|
EAR99
|
Samacsys Manufacturer |
|
Texas Instruments
|
Input Voltage-Max |
|
15 V
|
Input Voltage-Min |
|
-15 V
|
JESD-609 Code |
|
e4
|
Moisture Sensitivity Level |
|
2
|
Normal Position |
|
NO
|
Output |
|
COMMON OUTPUT
|
Package Equivalence Code |
|
SOP16,.4
|
Peak Reflow Temperature (Cel) |
|
260
|
Signal Current-Max |
|
0.02 A
|
Supply Current-Max (Isup) |
|
1.5 mA
|
Switching |
|
BREAK-BEFORE-MAKE
|
Technology |
|
CMOS
|
Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare 358RPFB with alternatives
Compare MPC508AU/1KG4 with alternatives