30KPA78A
vs
MX30KPA78A
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
NEW JERSEY SEMICONDUCTOR PRODUCTS INC
|
MICROSEMI CORP
|
| Reach Compliance Code |
unknown
|
unknown
|
| Breakdown Voltage-Min |
87.1 V
|
87.1 V
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
TRANS VOLTAGE SUPPRESSOR DIODE
|
TRANS VOLTAGE SUPPRESSOR DIODE
|
| Non-rep Peak Rev Power Dis-Max |
30000 W
|
30000 W
|
| Number of Elements |
1
|
1
|
| Operating Temperature-Max |
175 °C
|
150 °C
|
| Operating Temperature-Min |
-55 °C
|
-65 °C
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Rep Pk Reverse Voltage-Max |
78 V
|
78 V
|
| Technology |
AVALANCHE
|
AVALANCHE
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Base Number Matches |
14
|
1
|
| Rohs Code |
|
No
|
| Package Description |
|
PLASTIC PACKAGE-2
|
| Pin Count |
|
2
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.50
|
| Case Connection |
|
ISOLATED
|
| Clamping Voltage-Max |
|
129 V
|
| JESD-30 Code |
|
O-PALF-W2
|
| JESD-609 Code |
|
e0
|
| Moisture Sensitivity Level |
|
1
|
| Number of Terminals |
|
2
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Shape |
|
ROUND
|
| Package Style |
|
LONG FORM
|
| Power Dissipation-Max |
|
1.61 W
|
| Qualification Status |
|
Not Qualified
|
| Reference Standard |
|
MIL-19500
|
| Surface Mount |
|
NO
|
| Terminal Finish |
|
TIN LEAD
|
| Terminal Form |
|
WIRE
|
| Terminal Position |
|
AXIAL
|
|
|
|
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