30KPA66AE3 vs 30KP66-BP feature comparison

30KPA66AE3 Microsemi Corporation

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30KP66-BP Micro Commercial Components

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP MICRO COMMERCIAL COMPONENTS
Package Description O-PALF-W2 R-6, 2 PIN
Pin Count 2 2
Manufacturer Package Code P600
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Breakdown Voltage-Max 80.7 V 80.7 V
Breakdown Voltage-Min 73.7 V 73.7 V
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 Code O-PALF-W2 O-PALF-W2
JESD-609 Code e3 e3
Moisture Sensitivity Level 1 1
Non-rep Peak Rev Power Dis-Max 30000 W 30000 W
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 8 W 8 W
Rep Pk Reverse Voltage-Max 66 V 66 V
Surface Mount NO NO
Technology AVALANCHE AVALANCHE
Terminal Finish MATTE TIN MATTE TIN
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Base Number Matches 6 2
Breakdown Voltage-Nom 77.2 V
Clamping Voltage-Max 107 V
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Reference Standard UL RECOGNIZED
Time@Peak Reflow Temperature-Max (s) 10

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