301-330 vs RM06J331BP feature comparison

301-330 Xicon Passive Components

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RM06J331BP Cal-Chip Electronics

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Rohs Code Yes Yes
Part Life Cycle Code Contact Manufacturer Obsolete
Ihs Manufacturer XICON PASSIVE COMPONENTS CAL-CHIP ELECTRONICS INC
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
Construction Chip Glass Coat
Number of Terminals 2 2
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.45 mm 0.45 mm
Package Length 1.6 mm 1.6 mm
Package Style SMT SMT
Package Width 0.8 mm 0.8 mm
Packing Method TR BULK
Rated Power Dissipation (P) 0.0625 W 0.0625 W
Resistance 330 Ω 330 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Series CR5
Size Code 0603 0603
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 200 ppm/°C 200 ppm/°C
Tolerance 5% 5%
Working Voltage 50 V 50 V
Base Number Matches 4 1
Package Description CHIP
HTS Code 8533.21.00.30
JESD-609 Code e3
Mounting Feature SURFACE MOUNT
Package Shape RECTANGULAR PACKAGE
Rated Temperature 70 °C
Surface Mount YES
Terminal Finish Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND

Compare 301-330 with alternatives

Compare RM06J331BP with alternatives