2SK850
vs
IXTQ470P2
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
TOSHIBA CORP
IXYS CORP
Package Description
FLANGE MOUNT, R-PSFM-T3
PLASTIC, TO-3P, 3 PIN
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.29.00.95
Case Connection
DRAIN
DRAIN
Configuration
SINGLE
SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min
100 V
500 V
Drain Current-Max (ID)
35 A
42 A
Drain-source On Resistance-Max
0.06 Ω
0.145 Ω
FET Technology
METAL-OXIDE SEMICONDUCTOR
METAL-OXIDE SEMICONDUCTOR
JESD-30 Code
R-PSFM-T3
R-PSFM-T3
Number of Elements
1
1
Number of Terminals
3
3
Operating Mode
ENHANCEMENT MODE
ENHANCEMENT MODE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLANGE MOUNT
FLANGE MOUNT
Polarity/Channel Type
N-CHANNEL
N-CHANNEL
Power Dissipation Ambient-Max
150 W
Qualification Status
Not Qualified
Not Qualified
Surface Mount
NO
NO
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
SINGLE
SINGLE
Transistor Application
SWITCHING
SWITCHING
Transistor Element Material
SILICON
SILICON
Base Number Matches
1
2
Pbfree Code
Rohs Code
Part Package Code
TO-3P
Pin Count
3
Additional Feature
AVALANCHE RATED
Avalanche Energy Rating (Eas)
1300 mJ
Operating Temperature-Max
150 °C
Power Dissipation-Max (Abs)
830 W
Pulsed Drain Current-Max (IDM)
126 A
Terminal Finish
Pure Tin (Sn)
Compare 2SK850 with alternatives
Compare IXTQ470P2 with alternatives