2SK3647-01
vs
934055808127
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
FUJI ELECTRIC CO LTD
NXP SEMICONDUCTORS
Package Description
CHIP CARRIER, S-XBCC-N4
FLANGE MOUNT, R-PSFM-T3
Pin Count
4
3
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
Avalanche Energy Rating (Eas)
278 mJ
170 mJ
Case Connection
DRAIN
DRAIN
Configuration
SINGLE WITH BUILT-IN DIODE
SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min
100 V
100 V
Drain Current-Max (ID)
30 A
35 A
Drain-source On Resistance-Max
0.044 Ω
0.04 Ω
FET Technology
METAL-OXIDE SEMICONDUCTOR
METAL-OXIDE SEMICONDUCTOR
JESD-30 Code
S-XBCC-N4
R-PSFM-T3
Number of Elements
1
1
Number of Terminals
4
3
Operating Mode
ENHANCEMENT MODE
ENHANCEMENT MODE
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Shape
SQUARE
RECTANGULAR
Package Style
CHIP CARRIER
FLANGE MOUNT
Polarity/Channel Type
N-CHANNEL
N-CHANNEL
Pulsed Drain Current-Max (IDM)
120 A
140 A
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
NO
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Position
BOTTOM
SINGLE
Transistor Application
SWITCHING
SWITCHING
Transistor Element Material
SILICON
SILICON
Base Number Matches
1
1
Rohs Code
Part Package Code
TO-220AB
JEDEC-95 Code
TO-220AB
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare 2SK3647-01 with alternatives
Compare 934055808127 with alternatives