2SD874
vs
BC868-25
feature comparison
| Part Life Cycle Code |
Active
|
Transferred
|
| Part Package Code |
SOT-89
|
SOT-89
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Base Number Matches |
3
|
8
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Ihs Manufacturer |
|
NXP SEMICONDUCTORS
|
| Package Description |
|
PLASTIC, SOT-89, 3 PIN
|
| Pin Count |
|
3
|
| Case Connection |
|
COLLECTOR
|
| Collector Current-Max (IC) |
|
1 A
|
| Configuration |
|
SINGLE
|
| DC Current Gain-Min (hFE) |
|
160
|
| JESD-30 Code |
|
R-PSSO-F3
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
1
|
| Number of Elements |
|
1
|
| Number of Terminals |
|
3
|
| Operating Temperature-Max |
|
150 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Polarity/Channel Type |
|
NPN
|
| Power Dissipation-Max (Abs) |
|
1 W
|
| Qualification Status |
|
Not Qualified
|
| Surface Mount |
|
YES
|
| Terminal Finish |
|
Tin (Sn)
|
| Terminal Form |
|
FLAT
|
| Terminal Position |
|
SINGLE
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Transistor Application |
|
SWITCHING
|
| Transistor Element Material |
|
SILICON
|
|
|
|
Compare BC868-25 with alternatives