2SC5331 vs BU4508AF feature comparison

2SC5331 Toshiba America Electronic Components

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BU4508AF NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP NXP SEMICONDUCTORS
Package Description FLANGE MOUNT, R-PSFM-T3 FLANGE MOUNT, R-PSFM-T3
Pin Count 3 3
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.29.00.95 8541.29.00.95
Case Connection COLLECTOR ISOLATED
Collector Current-Max (IC) 15 A 8 A
Collector-Emitter Voltage-Max 600 V 800 V
Configuration SINGLE SINGLE
DC Current Gain-Min (hFE) 4.2 4.2
JESD-30 Code R-PSFM-T3 R-PSFM-T3
Number of Elements 1 1
Number of Terminals 3 3
Operating Temperature-Max 150 °C 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style FLANGE MOUNT FLANGE MOUNT
Polarity/Channel Type NPN NPN
Power Dissipation Ambient-Max 180 W 45 W
Power Dissipation-Max (Abs) 180 W 45 W
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position SINGLE SINGLE
Transistor Application SWITCHING SWITCHING
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 1.7 MHz
Turn-off Time-Max (toff) 4300 ns
VCEsat-Max 3 V 3 V
Base Number Matches 1 1
Rohs Code No
Part Package Code SFM
Manufacturer Package Code SOT199
Samacsys Manufacturer NXP

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