2SC3147 vs BLV13 feature comparison

2SC3147 Toshiba America Electronic Components

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BLV13 NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP NXP SEMICONDUCTORS
Package Description CERAMIC, 2-13C1A, 6 PIN FLANGE MOUNT, O-CRFM-F4
Reach Compliance Code unknown unknown
Highest Frequency Band VERY HIGH FREQUENCY BAND VERY HIGH FREQUENCY BAND
JESD-30 Code O-CXFM-F6 O-CRFM-F4
Number of Terminals 6 4
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Shape ROUND ROUND
Package Style FLANGE MOUNT FLANGE MOUNT
Polarity/Channel Type NPN NPN
Qualification Status Not Qualified Not Qualified
Surface Mount YES NO
Terminal Form FLAT FLAT
Terminal Position UNSPECIFIED RADIAL
Transistor Element Material SILICON SILICON
Base Number Matches 1 3
ECCN Code EAR99
Case Connection ISOLATED
Collector Current-Max (IC) 8 A
Collector-Emitter Voltage-Max 16.5 V
Configuration SINGLE
DC Current Gain-Min (hFE) 15
Number of Elements 1
Operating Temperature-Max 200 °C
Power Gain-Min (Gp) 8.5 dB
Transistor Application AMPLIFIER
Transition Frequency-Nom (fT) 1650 MHz

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