2PA1774QM,315
vs
2PA1774S
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
DFN
SC-75
Package Description
1 X 0.60 MM, 0.50 MM HEIGHT, ULTRA SMALL, PLASTIC, SC-101, 3 PIN
ROHS COMPLIANT, PLASTIC, SC-75, 3 PIN
Pin Count
3
3
Manufacturer Package Code
SOT883
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
Factory Lead Time
4 Weeks
Case Connection
COLLECTOR
Collector Current-Max (IC)
0.1 A
0.15 A
Collector-Emitter Voltage-Max
40 V
50 V
Configuration
SINGLE
SINGLE
DC Current Gain-Min (hFE)
120
270
JESD-30 Code
R-PBCC-N3
R-PDSO-G3
JESD-609 Code
e3
e3
Moisture Sensitivity Level
1
1
Number of Elements
1
1
Number of Terminals
3
3
Operating Temperature-Max
150 °C
150 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
260
Polarity/Channel Type
PNP
PNP
Power Dissipation-Max (Abs)
0.43 W
0.15 W
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Terminal Finish
TIN
Tin (Sn)
Terminal Form
NO LEAD
GULL WING
Terminal Position
BOTTOM
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Transistor Application
SWITCHING
SWITCHING
Transistor Element Material
SILICON
SILICON
Transition Frequency-Nom (fT)
100 MHz
100 MHz
Base Number Matches
1
10
Pbfree Code
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