2N7224UPBF
vs
IRFN150
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
INFINEON TECHNOLOGIES AG
SEMELAB LTD
Package Description
FLANGE MOUNT, R-MSFM-P3
CHIP CARRIER, R-XBCC-N3
Reach Compliance Code
compliant
compliant
Avalanche Energy Rating (Eas)
150 mJ
150 mJ
Case Connection
ISOLATED
DRAIN
Configuration
SINGLE WITH BUILT-IN DIODE
SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min
100 V
100 V
Drain Current-Max (ID)
34 A
27 A
Drain-source On Resistance-Max
0.081 Ω
0.081 Ω
FET Technology
METAL-OXIDE SEMICONDUCTOR
METAL-OXIDE SEMICONDUCTOR
JEDEC-95 Code
TO-254AA
JESD-30 Code
R-MSFM-P3
R-XBCC-N3
Number of Elements
1
1
Number of Terminals
3
3
Operating Mode
ENHANCEMENT MODE
ENHANCEMENT MODE
Package Body Material
METAL
UNSPECIFIED
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLANGE MOUNT
CHIP CARRIER
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Polarity/Channel Type
N-CHANNEL
N-CHANNEL
Pulsed Drain Current-Max (IDM)
136 A
108 A
Qualification Status
Not Qualified
Not Qualified
Surface Mount
NO
YES
Terminal Finish
NOT SPECIFIED
Terminal Form
PIN/PEG
NO LEAD
Terminal Position
SINGLE
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
NOT SPECIFIED
Transistor Application
SWITCHING
SWITCHING
Transistor Element Material
SILICON
SILICON
Base Number Matches
2
4
Pbfree Code
Part Package Code
TO-220SM
Pin Count
3
ECCN Code
EAR99
Operating Temperature-Max
150 °C
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