2N6672
vs
2N6672E3
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICROSEMI CORP
|
Package Description |
METAL CAN-2
|
METAL CAN-2
|
Pin Count |
2
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
Samacsys Manufacturer |
Microsemi Corporation
|
|
Collector Current-Max (IC) |
8 A
|
8 A
|
Collector-Emitter Voltage-Max |
350 V
|
350 V
|
DC Current Gain-Min (hFE) |
10
|
10
|
JEDEC-95 Code |
TO-3
|
TO-3
|
JESD-30 Code |
O-MBFM-P2
|
O-MBFM-P2
|
JESD-609 Code |
e0
|
|
Number of Terminals |
2
|
2
|
Package Body Material |
METAL
|
METAL
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Polarity/Channel Type |
NPN
|
NPN
|
Qualification Status |
Not Qualified
|
|
Surface Mount |
NO
|
NO
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
PIN/PEG
|
PIN/PEG
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Transistor Element Material |
SILICON
|
SILICON
|
Base Number Matches |
2
|
1
|
|
|
|