2N6660
vs
2N6659
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
SEMELAB LTD
|
| Package Description |
TO-39, 3 PIN
|
CYLINDRICAL, O-MBCY-W3
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
|
| Factory Lead Time |
6 Weeks
|
|
| Samacsys Manufacturer |
Microchip
|
|
| Additional Feature |
HIGH INPUT IMPEDANCE
|
|
| Case Connection |
DRAIN
|
DRAIN
|
| Configuration |
SINGLE WITH BUILT-IN DIODE
|
SINGLE
|
| DS Breakdown Voltage-Min |
60 V
|
|
| Drain Current-Max (ID) |
0.41 A
|
|
| Drain-source On Resistance-Max |
3 Ω
|
|
| FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
|
| Feedback Cap-Max (Crss) |
10 pF
|
|
| JEDEC-95 Code |
TO-39
|
TO-39
|
| JESD-30 Code |
O-MBCY-W3
|
O-MBCY-W3
|
| JESD-609 Code |
e4
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
3
|
3
|
| Operating Mode |
ENHANCEMENT MODE
|
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Package Body Material |
METAL
|
METAL
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
CYLINDRICAL
|
CYLINDRICAL
|
| Polarity/Channel Type |
N-CHANNEL
|
|
| Power Dissipation Ambient-Max |
6.25 W
|
|
| Power Dissipation-Max (Abs) |
6.25 W
|
|
| Pulsed Drain Current-Max (IDM) |
3 A
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reference Standard |
TS 16949
|
|
| Surface Mount |
NO
|
NO
|
| Terminal Finish |
NICKEL GOLD
|
|
| Terminal Form |
WIRE
|
WIRE
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Transistor Application |
SWITCHING
|
SWITCHING
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Turn-off Time-Max (toff) |
10 ns
|
|
| Turn-on Time-Max (ton) |
10 ns
|
|
| Base Number Matches |
3
|
6
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare 2N6660 with alternatives
Compare 2N6659 with alternatives