2N5885E3 vs 2N5885TIN/LEAD feature comparison

2N5885E3 Microsemi Corporation

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2N5885TIN/LEAD Central Semiconductor Corp

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROSEMI CORP CENTRAL SEMICONDUCTOR CORP
Package Description FLANGE MOUNT, O-MBFM-P2 FLANGE MOUNT, O-MBFM-P2
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
Collector Current-Max (IC) 25 A 25 A
Collector-Emitter Voltage-Max 60 V 60 V
DC Current Gain-Min (hFE) 20 4
JEDEC-95 Code TO-3 TO-3
JESD-30 Code O-MBFM-P2 O-MBFM-P2
Number of Terminals 2 2
Package Body Material METAL METAL
Package Shape ROUND ROUND
Package Style FLANGE MOUNT FLANGE MOUNT
Polarity/Channel Type NPN NPN
Surface Mount NO NO
Terminal Form PIN/PEG PIN/PEG
Terminal Position BOTTOM BOTTOM
Transistor Element Material SILICON SILICON
Base Number Matches 1 1
Rohs Code No
Date Of Intro 2018-01-30
Case Connection COLLECTOR
Collector-Base Capacitance-Max 1000 pF
Configuration SINGLE
Fall Time-Max (tf) 800 ns
JESD-609 Code e0
Number of Elements 1
Operating Temperature-Max 200 °C
Operating Temperature-Min -65 °C
Power Dissipation-Max (Abs) 200 W
Terminal Finish TIN LEAD
Transistor Application SWITCHING
Transition Frequency-Nom (fT) 4 MHz
Turn-off Time-Max (toff) 1800 ns
Turn-on Time-Max (ton) 700 ns
VCEsat-Max 4 V

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